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Basic Information

2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)

Website: http://www.ieee-mape.org/

Place

Chengdu, China

Conference Date

Aug 26 - Aug 29, 2022

Submission Deadline

Jun 25, 2022

Venue

Subjects: Communication Engineering

Sponsorship: 

Indexing: EI Compendex,Scopus

Short Description

△Full name: 2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)--EI Compendex, Scopus

△Abbreviation: IEEE MAPE
△Website:http://www.ieee-mape.org/
△Date:August 26 to 29, 2022
△Venue:Chengdu, China
 
Welcome to attend 2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE), which will be held in Chengdu, China from August 26 to 29, 2022. 
IEEE MAPE 2022 is sponsored by IEEE, Beijing Jiaotong University and University of Electronic Science and Technology of China, and is technically supported by the IEEE Antennas and Propagation Society. 
MAPE was initiated to celebrate of the 20th anniversary of the foundation of IEEE Beijing Section in 2005, after several years, it becomes the flagship wireless event of the IEEE Beijing Section geared toward wireless communication industry professionals interested in the latest research and design.
 
Publication:
Submitted papers will be peer reviewed and accepted papers after proper registration will be included in the conference proceedings to be published with conference proceedings, 
which will be submitted and reviewed by IEEE Xplore, EI Compendex and Scopus, etc.
 
Conference Committee:
International Advisory Committee:
    Cynthia Furse, IEEE Fellow, University of Utah, USA;
    David Davidson, IEEE Fellow, Curtin University, Australia;
    Hisamatsu Nakano, IEEE Life Fellow, Hosei University, Japan;
    Koichi Ito, IEEE Life Fellow, IEICE Fellow, Chiba University, Japan;
    Kwai Man Luk, IEEE Fellow, City University of Hong Kong, China;
    Yahia Antar, IEEE Fellow, Royal Military College, Canada;
    Banmali Rawat, University of Nevada, USA;
    Hiroshi Iwai, National Yang Ming Chiao Tung University, Taiwan, China;
    Petrie Meyer, Stellenbosch University, South Africa;
    Roberto Graglia, Politecnico di Torino, Italy;
    Weng Cho Chew, University of Illinois, USA.
 
Conferenc Co-chairs:
    W. Ross Stone, Chair of IEEE Publication Committee, Honorary Life Member of IEEE
    Yinghong Wen, Dean, Zhantianyou College, Beijing Jiaotong University, China
    Shiwen Yang, IEEE Fellow, University of Electronic Science and Technology of China, China
 
Technical Program Co-chairs:
    Makoto Ando, IEEE Fellow, Tokyo Institute of Technology, Japan
    Giuseppe Pelosi, University of Florence, Italy
    Yikai Chen, University of Electronic Science and Technology of China, China
    Wei Jiang, Beijing Jiaotong University, China
 
Regional Chair of Germany:
     Werner Wiesbeck, Karlsruhe Institut of Technology, Germany
 
Regional Chair of Canada:
     Lot Shafai, University of Manitoba, Canada
 
Regional Chair of Spain:
     Eva Rajo-Iglesia, University Carlos III of Madrid, Spain
 
Regional Chair of Singapore:
     Zhongxiang Shen, Nanyang Technological University, Singapore
 
Regional Chair of Harbin:
     Yingsong Li, Harbin Engineering University, China
 
Organizing Committee Chair:
     Mengqi Zhou, IEEE China Council, China
 
Technical Program Committee Members:
     Guo Xie, Xi'an University of Technology, China;
     Jinbao Zhang, Beijing Jiaotong University, China;
     Jiang Liu, Beijing Jiaotong University, China;
     Jinjun Feng, Beijing Vacuum Electronics Research Institute, China;
     Meng Li, Hefei University of Technology, China;
     Mitsuo Taguchi, Nagasaki University, Japan;
     Wenhua Yu, Computer and Communication Unlimited, USA;
     Yanzhao Xie, Xi'an Jiaotong University, China.
 
Call for papers:
The topics of the symposium will cover all of the interesting theory and techniques of microwaves, antennas, propagation, and EMC necessary for wireless communications. 
The topics included but not limited to below:
 
1. Systems and Services
* Mobile satellite communication
* WLANs
* Wireless Sensors and Ad Hoc Networks
* MIMO Technologies
* UWB and Impulse Radio
* 6G Mobile Wireless Systems
* Space-Time Channel Characterization and Modeling
 
2. Microwave Electronics
* Passive and Active Circuits
* Power Amplifiers, Linearization, and Active Components
* MMICs and Microwave Circuits
* Microwave and Millimetre-Wave ICs
* Millimetre-Wave and Sub-Millmetre-Wave Components,
Circuits and Systems
* Waveguide Structures
 
3. Antennas
* Microstrip and Printed Antennas
* Active and Integrated Antennas
* Array Antennas, Phased Arrays, and Feeding Circuits
* Mobile and Base Station Antennas
* Adaptive and Smart Antennas
* Ultra-Wideband, Broadband, and Multi-band Antennas
* Reconfigurable Antennas and Arrays
* Millimeter Wave and Sub-Millimeter Wave Antennas
* MEMS/Nanotechnology for antennas
 
4. Propagation
* Mobile and Indoor Propagation
* Millimeter- and Optical-Wave Propagation
* Earth-Space and Terrestrial Propagation
* Ionospheric Propagation
* Propagation and channel characterization
* Diversity Techniques and Fading Countermeasures
* Signal Separation and Interference Rejection
* Random Media and Rough Surfaces
 
5. Electromagnetics
* Electromagnetic Theory
* Metamaterials
* Complex Media and Artificial Media
* Computational Electromagnetics
* High-Frequency Techniques
* Time-Domain Techniques
 
6. EMC Technologies
* EMC Sources: Electromagnetic Environment, Lightning, Intentional EMI & EMP, High Power Electromagnetics, ESD, UWB
* EMC of Components & Integrated Circuits, PCB, Electronic Packaging & Integration
* EMC in Power Systems, Power Quality
* System Level EMC
* EMC in Power Electronics
* EMC in Smart Grids
* EMC in Internet of Things
* EMC in Communications: Wired & Wireless Communications, 6G, UWB, Power Line Communications
* EMC Standards, Management & Regulations
* EMC in Aerospace
 
Paper Submission:
Submission by MAPE 2022 EasyChair Account: 
https://easychair.org/my/conference?conf=ieeemape2022
 
Contact:
Conferenec Secretary: Frannie Lee
Contact Email: contact@ieee-mape.org
Tel: +86-13540032551

Contact

E-mail: contact@ieee-mape.org

Tel: +86-13540032551

Rank: ★★★★

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