International Conference on Engineering Technology, Smart Materials, Computing, Biotechnology, ICT & Applied Sciences (ETSM 2019)

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Basic Information

International Conference on Engineering Technology, Smart Materials, Computing, Biotechnology, ICT & Applied Sciences (ETSM 2019)

Website: http://aniceas.com/conferences/etsm-april-2019/

Place

Singapore , Singapore

Conference Date

Apr 03 - Apr 04, 2019

Submission Deadline

Mar 15, 2019

Venue

The Aqueen Hotel Paya Lebar 33 Jalan Afifi, Singapore 409180

Subjects: Communication Engineering

Sponsorship: 

Indexing: 

Short Description

Main Tracks of the conferences:

Track 1- Computer and Software Engineering

Track 2- Mechanical & Metallurgical Engineering

Track 3- Electrical & Electronics Engineering

Track 4- Civil Engineering

Track 5- Bio-Technology & Food Technology

Track 6- Chemistry & Chemical Engineering

Track 7- Physical, Applied and Life Sciences

Track 8- Interdisciplinary

Contact

E-mail: etsm@aniceas.com

Tel: 

Rank: ★★★★

Indexing

Online Proceedings:

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