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Basic Information

International Conference on Telecommunication, Engineering, Energy, Applied Sciences & Smart Materials (TEEAS 2019)

Website: https://gieas.org/upcoming-events/teeas-dec-2019/

Place

Singapore, Singapore

Conference Date

Dec 14 - Dec 15, 2019

Submission Deadline

Nov 20, 2019

Venue

Hotel Grand Pacific, Singapore

Subjects: Biosciences and Technologies

Sponsorship: 

Indexing: Scopus,EBSCO,Google Scholar

Short Description

The invited talk proposals can be submitted to teeas@gieas.org

The objective of GIEAS Forum is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Engineering, Technology and Applied Sciences.
The conference welcome papers on the following research topics but not limited to:
·         Fundamental and Applied Sciences
·         Material Science and Engineering
·         Electrical and Electronic Engineering
· Computer Engineering and Sciences
· Mechanical Engineering
· Biological Engineering
· Chemical Engineering
· Civil Engineering
· Environmental Engineering

Contact

E-mail: teeas@gieas.org

Tel: 

Rank: ★★★★

Indexing

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