Website: http://consortium-et.com/upcoming-events/reima-annual-conference/
Place
Osaka, Japan
Conference Date
Nov 21 - Nov 22, 2018
Submission Deadline
Nov 14, 2018
Venue
Osaka International Convention Center, Japan
Subjects: Civil, Water and Construction ;
Sponsorship:
Indexing: ISI,Scopus,EBSCO
Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.
E-mail: reima@consortium-et.com
Tel:
Rank: ★★★★
Online Proceedings:
Indexing Proof: View