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Basic Information

The 3rd International Conference on Empirical Evidence on Engineering, Basic and Applied Sciences Research (EEAS 2020)

Website: https://consortium-et.com/upcoming-events/eeas-annual-conference-2020/

Place

Osaka, Japan

Conference Date

Jun 27 - Jun 28, 2020

Submission Deadline

Jun 17, 2020

Venue

Hotel MyStays Shin-Osaka Conference Center

Subjects: Economics and Finance;

Sponsorship:

Indexing: ISI,Scopus,EBSCO,Google Scholar

Short Description

Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.

Contact

E-mail: eeas@consortium-et.com

Tel:

Rank: ★★★★

Indexing

Online Proceedings:

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