Home> Conference > Electronics and Electrical Engineering >

Views:

Basic Information

2021 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)

Website: http://icmee.org/

Place

Osaka, Japan

Conference Date

May 10 - May 12, 2021

Submission Deadline

Nov 25, 2020

Venue

Osaka International Convention Center

Subjects: Electronics and Electrical Engineering

Sponsorship: 

Indexing: EI Compendex,Scopus

Short Description

Full name: IOP--2021 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)--Ei Compendex, SCOPUS

Abbreviation : ICMEE 2021
 
2021 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka International Convention Center, Osaka, Japan) during (May 10-12, 2021)-<http://icmee.org/>
 
ICMEE 2021 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
 
Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc
 
{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6 
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6 
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 
 
{ Submission Method }
1. Send your manuscript directly to conference official email: icmee@outlook.com 
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021
 
{ Conference Scope }
The works that will be presented and published at conference will focus on, but are not limited to, the following topics:
 
Mechanical Engineering
Acoustics and Noise Control Marine System Design
Aerodynamics Material Engineering
Applied Mechanics Material Science and Processing
Automation, Mechatronics and Robotics Mechanical Design
Automobiles Mechanical Power Engineering
Automotive Engineering Mechatronics
Ballistics MEMS and Nano Technology
Biomechanics Multibody Dynamics
Biomedical Engineering Nanomaterial Engineering
CAD/CAM/CIM New and Renewable Energy
CFD Noise and Vibration
Composite and Smart Materials Noise Control
Compressible Flows Non-destructive Evaluation
Computational Mechanics Nonlinear Dynamics
Computational Techniques Oil and Gas Exploration
Dynamics and Vibration Operations Management
Energy Engineering and Management PC guided design and manufacture
Engineering Materials Plasticity Mechanics
...
 
{ Venue }
Osaka International Convention Center, Osaka, Japan
Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN
 
{ Contact }
Ms. Serene Lo
icmee@outlook.com 
+86-028-83208181

Contact

E-mail: icmee@outlook.com

Tel: +86-028-83208181

Rank: ★★★★

Indexing

Online Proceedings:

Indexing Proof: View

Related Resources