Website: https://www.keoaeic.org/Iconf-EM2018
Place
Shenzhen, China
Conference Date
Aug 17 - Aug 19, 2018
Submission Deadline
Aug 13, 2018
Venue
Shenzhen
Subjects: Electronics and Electrical Engineering;
Sponsorship:
Indexing: EI Compendex,SCI
I. Conference Date:Aug 17-19,2018
II. Venue:Shenzhen,China
III. Conference Website:https://www.keoaeic.org/Iconf-EM2018
IV. Publication:All accepted full papers will be published in the conference proceedings by Conference Publishing Services ( IOP Conference Series: Materials Science and Engineering (MSE)) and will be submitted to EI Compendex, Scopus for indexing. The journal of EI Compendex is very stable now.
Iconf-EM 2016:Hyperlink search(click)
Iconf-EM 2017:full paper have been published and will be retrieved soon
IV.Call For Papers
(1)Engineering and Management
(2)Economy and Management
(3)Industrial Engineering and Management
(4)Safety Engineering and Management
(5)Information Engineering and Management
(6)Other Related Topics
V.Submission
A. Full Paper (for Presentation and Publication)
B. Abstract (Presentation only)
Please submit your paper and Paper Submission Form to iconfem@163.com
or Please send the full paper & abstract to AEIC SUBMISSION SYSTEM. https://www.keoaeic.org/cfplogin.html
VI.Submission Deadline: July 13yh, 2018
Contact us
Conference secretary:Dr.Lin
E-mail:iconfem@163.com
Tel:+86-020-28101036
Wechat:+86-18102545612
QQ:2578989287
E-mail: iconfem@163.com
Tel: +86-020- 28101036 /+-86- 18102545612
Rank: ★★★★
Online Proceedings:
Indexing Proof: View