Home> Conference > Electronics and Electrical Engineering >

Views:

Basic Information

2020 The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)

Website: http://icmee.org/

Place

Osaka, Japan

Conference Date

May 10 - May 12, 2020

Submission Deadline

Dec 10, 2019

Venue

Osaka Convention Center, Osaka, Japan

Subjects: Electronics and Electrical Engineering

Sponsorship: 

Indexing: EI Compendex,Scopus

Short Description

2020 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka Convention Center, Osaka, Japan) during (May 10-12, 2020)-<http://icmee.org/>

 
ICMEE 2020 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
 
Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including <Ei Compendex, Scopus>, etc
 
{ History }
The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 
The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 
The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6 
The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6 
The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 
 
{ Submission Method }
1. Send your manuscript directly to conference official email: icmee@outlook.com 
2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020
 
{ Conference Scope }
The works that will be presented and published at conference will focus on, but are not limited to, the following topics:
Mechanical Engineering
Acoustics and Noise Control Marine System Design
Aerodynamics Material Engineering
Applied Mechanics Material Science and Processing
Automation, Mechatronics and Robotics Mechanical Design
Automobiles Mechanical Power Engineering
Automotive Engineering Mechatronics
Ballistics MEMS and Nano Technology
Biomechanics Multibody Dynamics
Biomedical Engineering Nanomaterial Engineering
CAD/CAM/CIM New and Renewable Energy
CFD Noise and Vibration
Composite and Smart Materials Noise Control
Compressible Flows Non-destructive Evaluation
Computational Mechanics Nonlinear Dynamics
Computational Techniques Oil and Gas Exploration
Dynamics and Vibration Operations Management
Energy Engineering and Management PC guided design and manufacture
Engineering Materials Plasticity Mechanics
...
 
{ Venue }
Osaka Convention Center, Osaka, Japan
Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN
 
{ Contact }
Ms. Serene Lo
icmee@outlook.com 
+86-028-83208181

Contact

E-mail: icmee@outlook.com

Tel: +86-028-83208181

Rank: ★★★★

Indexing

Online Proceedings:

Indexing Proof: View

Related Resources