Website: http://ismis2017.ii.pw.edu.pl/
Place
Warsaw, Poland
Conference Date
Jun 26 - Jun 29, 2017
Submission Deadline
Feb 09, 2017
Venue
Subjects: Computer Science and Technologies;
Sponsorship:
Indexing:
Welcome to ISMIS 2017
23rd International Symposium on Methodologies for Intelligent Systems
ISMIS is an established and prestigious conference for exchanging the latest research results in building intelligent systems. Held twice every three years, the conference provides a medium for exchanging scientific research and technological achievements accomplished by the international community.
In June 2017, ISMIS will be held in Warsaw, Poland. The previous ISMIS conferences that were organized in Poland took place in Zakopane in 1996 and in Warsaw in 1999 and 2011.
Conference Scope
The scope of ISMIS is intended to represent a wide range of topics on applying Artificial Intelligence techniques to areas as diverse as decision support, automated deduction, reasoning, knowledge based systems, machine learning, computer vision, robotics, planning, databases, information retrieval, etc. The focus is on research in intelligent systems. The conference addresses issues involving solutions to problems that are complex to be solved through conventional approaches and that require the simulation of intelligent thought processes, heuristics and applications of knowledge. The integration of these multiple approaches in solving complex problems is of particular importance. ISMIS provides a forum and a means for exchanging information for those interested purely in theory, those interested primarily in implementation, and those interested in specific research and industrial applications.
Important Dates
Paper submission due: January 29, 2017
ISMIS 2017 Paper Submission
Authors are invited to submit original unpublished manuscripts that demonstrate current research on one of the ISMIS topics of interest. Papers should be prepared using the Springer LNCS/LNAI style (please see this page), maximum 10 pages.
E-mail: ismis@163.com
Tel:
Rank: ★★★★
Online Proceedings:
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