◆Intro:

Design and technology co-optimization provide key advantage in the highly competitive market today. However, integrated circuit (IC) engineering traditionally separates design and technology and the two don’t use the same language, let alone understand each other. This is not a winning approach moving forward. Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one to one basis during the poster session.

 

◆Call for Papers:

Contributed papers are solicited but not limited in the following subject areas:

* Advanced materials and processing technologies, Power semiconductor technologies and circuits

* Advanced transistor and interconnect structures

* Advanced Packaging, vertical (2.5D/3D) integration

* Variation and fault-tolerant designs, Reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability

* RF, analog, mixed signal, and I/O circuits for future technology generations

* Simulation and modeling of advanced processes, devices, and circuits

* Design for manufacturing, yield, and test, System-on-Chip (SoC) and system-in-package (SiP) design integration

* Emerging technologies, circuits and Applications (MEMS, memory, Internet of Thing, Autonomous cars, Machine Learning, Artificial Intelligence)

 

◆Publication:

Accepted papers will be included in the conference proceedings published by IEEE. The proceedings will be submitted and reviewed by the IEEE Xplore and Ei Compendex and Scopus after the conference.

 

◆Executive Committee:

Advisory Committee: Ming Liu (IMECAS) & Hui Yang (Sinano) & Yin Shi (IOS)

2019 Conference Chair: Yilong Hao (PKU)

2019 Conference Co-chair: Yao-Hui Zhang (Sinano) & Cezhou Zhao (XJTLU) & Mingxiang Wang (Soochow Univ.)

General Chair: Stefano D’Amico (Univ. of Salento) & Andrea Scarpa (NXP Semiconductors)

Executive Chair: Bich-Yen Nguyen (Soitec) & Thuy Dao (NXP)

Keynote Chair: Mariam Sadaka (MWM Consulting) & Yao-Hui Zhang (Sinano)

Technical Conference Chair: Mingxiang Wang (Soochow Univ) & Xiao Gong (NUS) & Cuiqin Xu (Huali) & Yan Wang (TSU)

Local Arrangement Chair: Helun Song(Sinano) & Ying Li (Soochow Univ.) & Wen Liu (XJTLU) & Shouxiang Li (SICIA)

Tutorial Chair: Oliver Weber (CEA-Leti) & Xiangming Xu (HiSilicon)

Exhibition Chair: Xuefeng Shao (ON Semiconductor) & ZG Tay (ON Semiconductor)

Publicity & Award Chair: Kin P. Cheung (NIST) & Maojun Wang (PKU)

Publication Chair: Chun Zhao (XJTLU) & Desheng Jiang (ISCAS) & Yi Zhao(ZJU)

Finance Chair: Helun Song (Sinano) & Dina Triyoso (TEL) & Wen Liu (XJTLU)

Secretary: Zhanqiang Ru (Sinano)

 

◆Submission Methods: 

Please submit 2-4 pages English paper in IEEE template (http://www.icicdt.net/Author.html). For paper submission and submission requirements, please click the website link: http://www.icicdt.net/Submission.html

 

◆Exhibition:

ICICDT 2019 will hold exhibition for companies to make publicity of their products and services. For booth booking and more information about the exhibition, please visit: http://www.icicdt.net/Exhibition.html

 

◆Contact:

For information about paper submission, please contact: 

Chun Zhao 

Xi’an Jiaotong-liverpool University 111 Ren'ai Road Suzhou China 

E-Mail: chun.zhao@xjtlu.edu.cn 

 

For information about registration, etc. please contact: 

Wen Liu 

Xi’an Jiaotong-liverpool University 111 Ren'ai Road Suzhou China 

E-Mail: wen.liu@xjtlu.edu.cn 

Tel:+86-13913118798(From 8 a.m. to 8 p.m. Beijing Time)