Subjects:
Material Sciences;
Sponsorship:
Indexing: EI Compendex,Scopus
Short Description
Full Name: 2021 5th International Conference on Sensors, Materials and Manufacturing
Abbreviation: ICSMM 2021
*Title: 2021 5th International Conference on Sensors, Materials and Manufacturing -- EI Compendex & Scopus
*Date&location: November 19-21, 2021 & University of Macau, China
*Website: www.icsmm.org
1. Publication:
The registered and presented papers will be published in Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus.
2. Pulibcation History:
ICSMM 2020 Key Engineering Materials: Volume 891. [ISBN: 978-3-0357-1789-1] (will be indexed soon...)
ICSMM 2019 Solid State Phenomena: Volume 305. [ISBN: 978-3-0357-1657-3] (Ei Compendex & Scopus)
ICSMM 2018 Material Science Forum: Volume 962. [ISBN: 978-3-0357-1416-6] (Ei Compendex & Scopus)
ICSMM 2017 IOP Conference Series: Materials Science and Engineering, VoL.311. (Ei Compendex & Scopus)
3. Speakers:
* Prof. Kwang Leong Choy, University College London, UK
* Prof. Hui Pan, University of Macau (UM), China
* Prof. Feng Xing, Shenzhen University, China
* Prof. Shen-Ming Chen, National Taipei University of Technology, Taiwan
* Prof. Han-Yong Jeon, Inha University, South Korea
4. Submission Methods:
Two kinds of proposals are accepted: Abstract for oral presenation & Full paper for publication and oral presentation.(English Only)
* System submission: http://confsys.iconf.org/submission/icsmm2021
* Email submission: icsmm@cbees.net
For submission guidline, please visit: http://www.icsmm.org/sub.html
5. Conference Topics:
* New Materials and Advanced Materials
* Materials Processing Engineering
* Electronic Materials
* Sensor Technology
For more topics, please visit: http://www.icsmm.org/cfp.html
6. Contact us:
Ms. Elva Zhang
Tel: +86-28-87577778
E-mail: icsmm@cbees.net
Website: www.icsmm.org
Contact
E-mail: icsmm@cbees.net
Tel: +86-28-87577778
Rank: ★★★★
Indexing
Online Proceedings:
Indexing Proof: View
