Subjects:
Material Sciences;
Sponsorship: Chengdu Zhonghang Exhibision&Service Co, Ltd
Indexing: EI Compendex,Scopus
Short Description
2018 3rd International Conference on Materials Engineering and Nanotechnology (ICMEN2018)
July 19-21, 2018
Morito Memorial Hall - Tokyo University of Science, Kagurazaka campus, Tokyo, Japan
Official website:http://www.icmen.org/
2018 3rd International Conference on Materials Engineering and Nanotechnology (ICMEN2018) will be held in Morito Memorial Hall - Tokyo University of Science, Kagurazaka campus, Tokyo, Japan during July 19-21, 2018.
Publication:
All submissions will be peer reviewed by 2-3 reviewers. The registered and presented papers will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752) Indexed by Elsevier: SCOPUS, Ei Compendex (CPX).
Submission:
ICMEN 2018 is now accepting manuscript submissions.
Please submit your full paper to us:icmen@zhconf.ac.cn
Call for Paper:
Topics of interest for submission include, but are not limited to:
Materials Engineering
Advanced Characterization
Biological Materials
Biotechnology and Life Sciences
Bulk Crystal Growth
Characterization
Computational Materials Science
Corrosion and Environmental Effects
Electronic Materials
Electronic, Optical, and Magnetic Properties
Energy and Environmental Technology
Information and Telecommunications Technology
Nanotechnology
Nanotechnology and Materials Sciences
Materials Science and Engineering: Nanotechnology
Advanced Applications in Nanoscience and Nanotechnology
Carbon Nanotubes and Biomolecules
Nanomaterials
Nanoelectronics
More topics about ICMEN2018,please see the website.
Conference Schedule:
July 19, 2018 : Registration, collecting conference materials
July 20, 2018 : Opening Remarks & Keynote Speeches(A.M.) Oral & Poster Sessions(P.M.)
July 21, 2018 : Visit / Tour
Contact us:
Ms. Echo J. Nie
Email: icmen@zhconf.ac.cn
Tel: +86-28-83533337
website: http://www.icmen.org/
Contact
E-mail: icmen@zhconf.ac.cn
Tel: +86-28-83533337
Rank: ★★★★
Indexing
Online Proceedings:
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