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Basic Information

2020 Spring International Conference on Material Sciences and Technology (MST-S 2020)

Website: http://www.scetconf.org/conference/SCET2020/MST.htm

Place

Xi'an, China

Conference Date

Apr 24 - Apr 26, 2020

Submission Deadline

Mar 24, 2020

Venue

No.172 Lianhu Road, Lianhu District, Xi'an, China

Subjects: Material Sciences

Sponsorship: Engineering Information Institute

Indexing: EI Compendex,Google Scholar

Short Description

2020 Spring International Conference on Material Sciences and Technology (MST-S)

Conference Date: April 24-26, 2020
Conference Venue: Xi'an, China
Website: http://www.scetconf.org/conference/SCET2020/
Online Registration System: http://www.scetconf.org/RegistrationSubmission/default.aspx?ConferenceID=1251
Email: scet_service@163.com

The 9th Spring World Congress on Engineering and Technology (SCET 2020) to be held on April 24-26, 2020 in Xi'an, China, is composed of 3 Symposiums on the frontier topics in the engineering and technological subjects. It dedicates to facilitating the global development of engineering and technology and exploring ways in which the latest research results can be shared.

Symposiums:

2020 Spring International Conference on Material Sciences and Technology (MST-S)
2020 Spring International Conference on Textile Science and Engineering (CTSE-S)
2020 Spring International Conference on Mineral Processing and Metallurgical Engineering (MPME-S)

Invited Speakers

Prof. Bingang Xu, Institute of Textile and Clothing, Hong Kong Polytechnic University, Hong Kong (China)
Prof. Sergei Alexandrov, Beihang University, China
Prof. Lee D. Wilson, University of Saskatchewan, Canada

If you wish to serve the conference as an invited speaker, please send email to us with your CV. We'll contact with you asap.

Publication and Presentation

All the accepted papers will be published in the journal of Materials Science Forum owned by TTP publishing in Switzerland and submitted to Ei Compendex databases for indexing.

Contact Us

Email: scet_service@163.com
Tel: +86 151 7233 0844
QQ: 741494290
Wechat: 3025797047

Attendance Methods

1.Submit full paper (Regular Attendance+Paper Publication+Presentation)
You are welcome to submit full paper, all the accepted papers will be published in the journal of Materials Science Forum owned by TTP publishing in Switzerland and submitted to Ei Compendex databases for indexing..
2. Submit abstract (Regular Attendance+Abstract+Presentation)
3. Regular Attendance (No Submission Required) 

Conference Topics

Fundamentals of Materials Science 
Materials Physics and Chemistry 
Mechanics of Materials 
Phase change of Materials 
Surface and Interface of Materials 
Texture, Structure, Defect and Performance of Materials 
Metallography 
Ceramography 
Polymer Materials Science 
Computational Materials Science 
Innovations in Materials Technology 
Design, Modeling and Simulation of Materials 
Materials Synthesis/Manufacturing 
Materials Processing Technology 
Welding and Joining 
Surface Treatments and Coatings 
Failure and Protection of Materials 
Materials Testing and Analysis 
Thin Film Materials and Technology 
Energetic Materials and Technology 
Function Test and Evaluation Technology
Packaging Technology 
Green Technology 
Applications of Materials Science and Technology
Polymeric Materials (Plastics, Rubbers, Fibers, Coatings, etc. ) 
Inorganic Nonmetallic Materials (Glasses, Ceramics, Cement, etc. ) 
Metallic Materials (Metals and Alloys) 
Advanced Composite Materials 
Refractories and Hard Materials 
Nanomaterials 
Biomaterials

Contact

E-mail: subconf@126.com

Tel: 13264702250

Rank: ★★★★

Indexing

Online Proceedings:

Indexing Proof: View

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