EI Compendex Call for Papers 2026-2027: Top Indexed Engineering Conferences

For mechanical, civil, and electrical engineers, as well as academic researchers globally, publishing in a conference indexed by EI Compendex (Engineering Village) is a critical benchmark for career advancement and academic graduation requirements. Recognized as the broadest and most complete engineering literature database in the world, EI Compendex guarantees rigorous peer review and massive global citation potential.

For scholars planning their publication roadmaps for $2026$ and $2027$, selecting a verified, high-impact venue is paramount.

Below is your ultimate call-for-papers submission guide to $12$ top-tier engineering conferences spanning robotics, electrical systems, civil materials, and automation. All featured venues are verified for EI Compendex and Scopus indexation.

1. Electrical, Electronics & Communication Engineering

These premier symposia focus on next-generation power grids, power conversion algorithms, high-frequency solid-state electronics, and telecommunications.

ACEEE 2026: 9th Asian Conference on Energy and Electrical Engineering

• Location: Qingdao, China

• Dates: July 24–26, 2026

• Submission Deadline: May 25, 2026

• Core Scopes: Smart grids, power system optimization, renewable electrical machinery, and sustainable resource allocation.

• Indexing: EI Compendex, Scopus (Published by IEEE)

• Official Website: https://www.aceee.net/

PSET 2026: 5th International Conference on Power System and Electrical Technology

• Location: Osaka, Japan

• Dates: August 17–21, 2026

• Submission Deadline: June 15, 2026

• Core Scopes: High-voltage grids, smart grid operations, power electronic devices, and electrical layouts.

• Indexing: EI Compendex, Scopus (Published by IEEE)

• Official Website: https://www.pset.org/

ICECE 2026: 9th International Conference on Electronics and Communication Engineering

• Location: Xi'an, China

• Dates: December 26–28, 2026

• Submission Deadline: June 20, 2026

• Core Scopes: Electronic circuitry, optical communications, smart sensors, and solid-state devices.

• Indexing: EI Compendex, Scopus

• Official Website: https://www.icece.net/

ICCCAS 2026: 15th International Conference on Communications, Circuits and Systems

• Location: Takasaki, Japan

• Dates: July 7–10, 2026

• Submission Deadline: May 25, 2026

• Core Scopes: Integrated digital circuits, communication signal modeling, and electro-mechanical systems.

• Indexing: EI Compendex, Scopus (Published by IEEE)

• Official Website: https://www.icccas.org/

AEEES 2027: 9th Asia Energy and Electrical Engineering Symposium

• Location: Chengdu, China

• Dates: March 19–22, 2027

• Submission Deadline: October 30, 2026

• Core Scopes: Smart grid control software, power converters, clean energy networks, and high-voltage insulation systems.

• Indexing: EI Compendex, Scopus (Published by IEEE)

• Official Website: http://aeees.org/

2. Robotics, Automation & Machine Vision

Showcasing mechanical control mechanisms, automated industrial arms, mechatronics, and artificial intelligence integration in physical systems.

ICCAE 2027: 19th International Conference on Computer and Automation Engineering

• Location: Melbourne, Australia

• Dates: March 12–14, 2027

• Submission Deadline: October 20, 2026

• Core Scopes: Computer-aided automation systems, software engineering frameworks, mechatronic computing, and smart robotic controls.

• Indexing: EI Compendex, Scopus

• Official Website: http://www.iccae.org/

ICRCA 2027: 11th International Conference on Robotics, Control and Automation

• Location: Aizu-Wakamatsu, Japan

• Dates: March 26–28, 2027

• Submission Deadline: November 10, 2026

• Core Scopes: Robotic structures, mechanical control mechanisms, industrial automation pipelines, and human-machine interface computing.

• Indexing: EI Compendex, Scopus

• Official Website: http://www.icrca.org/

ICRMV 2027: 11th International Conference on Robotics and Machine Vision

• Location: Hangzhou, China

• Dates: March 19–21, 2027

• Submission Deadline: November 1, 2026

• Core Scopes: $3$D scene reconstruction, camera networks, industrial automated arms, and predictive pathfinding algorithms.

• Indexing: EI Compendex, Scopus

• Official Website: https://www.icrmv.org/

3. Civil, Energy & Functional Materials Engineering

Addressing the physical layers of engineering, including civil architectural planning, sustainable construction composites, and energy integration.

CEAC 2027: 7th International Conference on Civil Engineering and Architecture

• Location: Hanoi, Vietnam

• Dates: March 12–15, 2027

• Submission Deadline: October 20, 2026

• Core Scopes: Structural computing engineering, sustainable architecture, urban infrastructure planning, and green civil materials.

• Indexing: EI Compendex, Scopus (Published by Springer)

• Official Website: https://www.ceac.net/

ICCBM 2027: 11th International Conference on Civil and Building Materials

• Location: Phuket, Thailand

• Dates: January 23–25, 2027

• Submission Deadline: September 5, 2026

• Core Scopes: Green building polymers, concrete structures, sustainable building designs, and structural safety modeling.

• Indexing: EI Compendex, Scopus

• Official Website: http://iccbm.org/

ICMFM 2027: 6th International Conference on Materials Engineering and Functional Materials

• Location: Da Nang, Vietnam

• Dates: March 1–4, 2027

• Submission Deadline: October 20, 2026

• Core Scopes: High-performance functional composites, polymer mechanics, nanofabrication, and manufacturing engineering.

• Indexing: EI Compendex, Scopus (Published by Springer)

• Official Website: https://www.icmfm.org/

ICSEE 2027: 11th International Conference on Sustainable Energy Engineering

• Location: Adelaide, Australia

• Dates: January 14–16, 2027

• Submission Deadline: August 15, 2026

• Core Scopes: Energy resources, sustainable engineering designs, grid-connected storage devices, and environmental management.

• Indexing: EI Compendex, Scopus (Published by Springer)

• Official Website: http://www.icsee.org/

4. Quick Reference Matrix: EI Compendex Engineering Symposia

Compare submission timelines and directly access official submission platforms using the table below.