ICICM 2024 | 2024 The 9th International Conference on Integrated Circuits and Microsystems

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Basic Information

ICICM 2024 | 2024 The 9th International Conference on Integrated Circuits and Microsystems

Website: http://icicm.net/

Place

Wuhan, China

Conference Date

Oct 25 - Oct 27, 2024

Submission Deadline

Aug 05, 2024

Venue

Subjects: Computer Science and Technologies

Sponsorship: 

Indexing: EI Compendex,Scopus

Short Description

★IEEE ICICM2024--Ei Compendex,Scopus--Wuhan, China★

 
★Full name: IEEE--2024 The 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
★Abbreviation: ICICM 2024
**Place: Wuhan, China
**Time: October 25-27, 2024
**Website: http://icicm.net/
 
★Co-Sponsored by: 
==Southeast University, China 
==University of Electronic Science and Technology of China, China 
==Wuhan University of Technology, China
 
==Submission==
1. Full paper (publication and presentation) 
2. Abstract (presentation only) 
**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024
**Email submission:  icicm_conf@vip.163.com 
More detail about submission, please visit at http://icicm.net/submission.html
 
=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already!
 
=Topics (include but not limit)=
► Devices and Circuits for Wirless System
► Application Specific Circuits and Systems for Communication
► Digital, Analog, Mixed Signal IC and SOC design technology
► Silicon integrated circuits and manufacturing
► Low-power, RF devices & circuits
► IC Computer-Aided –Design technology, DFM
► Silicon/germanium devices and device physics
► Interconnect, Low K, High K and other process technologies
► Unconventional and nano-electronics
► Organic semiconductor devices and technologies
► Compound semiconductor devices and circuits
► Displays, sensors and MEMS
► Semiconductor materials and material characterization
► Packaging and testing technology
► Solar cell & other devices for new energy sources
► Modeling and simulation
► Equipment technology
► Reliability
► Displays, sensors and MEMS
► Advance memories technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
 
==Organizing Committee==
**Advisory Chairs
Pui-in Mak, University of Macau, Macau, China
Ljiljana Trajkovic, Simon Fraser University, Canada
 
**Conference Chairs
Zhigong Wang, Southeast University, China
Chen Liu, Nanjing University of Posts and Telecommunica

Contact

E-mail: icicm_conf@vip.163.com

Tel: 

Rank: ★★★★

Indexing

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