Subjects:
Material Sciences;
Sponsorship:
Indexing: Scopus,Google Scholar
Short Description
* ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications.
* Publication:
Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.
1.Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
2.Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
3.Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
4.Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.
* History:
ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7-Online Linkage | Indexed by Scopus
ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7-Online Linkage | Indexed by Scopus
ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7-Online Linkage | Indexed by Scopus
ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9-Online Linkage | Indexed by Ei Compendex & Scopus
ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0-Online Linkage | Indexed by Ei Compendex & Scopus
* Conference Committee
Conference Chairs:
Osamu Tabata, Kyoto University of Advanced Science, Japan;
Takashige Omatsu, Chiba University, Japan.
Program Chairs:
Masahiro Nomura, The University of Tokyo, Japan;
Kwang Leong Choy, Duke Kunshan University, China.
Program Co-Chairs:
Yoshio Kobayashi, Ibaraki University, Japan;
Anatoly Zinchenko, Nagoya University, Japan.
......
More info about conference Committees: https://icmda.org/com.html
* Submission Method:
System Submission: https://confsys.iconf.org/submission/icmda2026
Email Submission: icmda@cbees.net
For more details, you can learn through: https://icmda.org/sub.html
* Call for Paper:
-Materials Properties, Measuring Methods and Applications
Creep-resistance
Fracture Mechanics
Mechanical Propertie
-Materials Analyses and Modeling
Electron Microscopy
Artificial Intelligence Methods
Computational Material Science
-Materials Science and Materials Processing Technology
Optical / Electrical / Magnetic Materials
Environmental-Friendly Materials
Surface Engineering / Coatings Technology
For more topics, please visit: http://www.icmda.org/cfp.html
* Contact Us:
Conference Secretary: Ms. Lynn
Tel: +852-3155-4897/+86-28-87577778
Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)
Contact
E-mail: icmda@cbees.net
Tel: +852-3155-4897
Rank: ★★★★
Indexing
Online Proceedings:
Indexing Proof: View
