Smart Materials in Winter Wonderland. 

The 10th International Conference on Smart Materials Applications (ICSMA 2027) will be held during January 8-10, 2027 in Sapporo, the capital of Hokkaido, known as Japan's "Snow Country". Here, you can enjoy a unique winter experience of snowscapes, hot springs, canals, and gourmet food. 

 ICSMA 2027 is co-organized by the South Asia Institute of Science and Engineering (SAISE), Tokyo University of Science (Japan), Yonsei University (South Korea), and Sichuan University (China), focusing on new advances and applications in the field of smart materials and providing a broad platform for experts and scholars in related fields to exchange the latest research results and discuss academic development directions.

 

**Committees:  

Conference Committee Chairs:  

Prof. Kazuo Umemura, Tokyo University of Science, Japan  

Prof. Jong Hak Kim, Yonsei University, South Korea  

Prof. Xiaohong Zhu, Sichuan University, China  

 

Program Committee Chairs:

Assoc. Prof. Jung Tae Park, Yonsei University, South Korea  

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore  

Dr. Seok-Keun Koh, C&G Hitech Co., Ltd, Korea  

 

**Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published in the journals of Scientific.Net(https://www.scientific.net/) collection. Indexed by Elsevier: SCOPUS.

 

**History of ICSMA:

ICSMA 2026 | JANUARY 28-30, 2026 | TOKYO UNIVERSITY OF SCIENCE, JAPAN.

ICSMA 2025 | JANUARY 8-10, 2025 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2024 | JANUARY 14-16, 2024 | SINGAPORE

ICSMA 2023 | JANUARY 06-08, 2023 | TOKYO, JAPAN

ICSMA 2022 | JANUARY 21-24, 2022 | VIRTUAL CONFERENCE

ICSMA 2021 | JANUARY 21-24, 2021 | VIRTUAL CONFERENCE

ICSMA 2020 | JANUARY 13-16, 2020 | YONSEI UNIVERSITY, SOUTH KOREA

ICSMA 2019 | JANUARY 19-22, 2019 | TOKYO, JAPAN

ICSMA 2018 | JANUARY 26-28, 2018 | SINGAPORE

 

**Call for Papers:

(01) Smart & Functional Materials

(02) Material Properties & Characterization   

(03) Manufacturing & Processing

(04) Computational & AI-Driven Approaches

(05) Applications & Sustainability

For more topics, please visit: https://www.icsma.org/cfp.html  

 

**Submission:

Please upload your abstract/full paper to iconf. Submission System (http://confsys.iconf.org/submission/icsma2027). Any questions, please feel free to contact via [email protected].

1. Full Paper (Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceeding.

2. Abstract (Presentation only)

Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published.

★ For more details, please visit: https://www.icsma.org/submission.html  

 

**Conference Schedule:

2027.01.08: Sign-in & Conference Kit Collection  

2027.01.09: Opening Ceremony, Keynote Speeches, Parallel Sessions, Dinner Banquet  

2027.01.10: Parallel Sessions, Tour/Visit (Optional)  

 

**Contact Us:

Ms. Sia Fan 

Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)