ICMDA 2027 | 2027 10th International Conference on Materials Design and Applications

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Basic Information

ICMDA 2027 | 2027 10th International Conference on Materials Design and Applications

Website: https://www.icmda.org/

Place

Hiroshima, Japan

Conference Date

Apr 08 - Apr 11, 2027

Submission Deadline

Nov 20, 2026

Venue

Subjects: Material Sciences; 

Sponsorship: 

Indexing: Scopus,Google Scholar

Short Description

* Full Name: 2027 10th International Conference on Materials Design and Applications (ICMDA 2027)

* Conference Venue: Hiroshima, Japan
* Conference Date: April 8-11, 2027
 
* ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications.
 
* Publication:
  Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.
 
  Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)
  Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)
  Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)
  Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
 
  Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.
 
* History: 
   ICMDA 2025: Vol. 1162. Materials Science Forum-ISBN: 978-3-0364-0958-0  | Indexed by Scopus
   ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7 | Indexed by Scopus
   ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7 | Indexed by Scopus  
   ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7 | Indexed by Scopus
   ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1| Indexed by Ei Compendex & Scopus
   ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7 | Indexed by Ei Compendex & Scopus
   ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9 | Indexed by Ei Compendex & Scopus
   ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0 | Indexed by Ei Compendex & Scopus
 
* Conference Committee:
  Conference Chair:
  Takashige Omatsu, Chiba University, Japan
 
  Program Chairs:
  Masahiro Nomura, The University of Tokyo, Japan
  Kwang Leong Choy, Duke Kunshan University, China
 
  Technical Program Chairs:
  Yoshio Kobayashi, Ibaraki University, Japan
  Anatoly Zinchenko, Nagoya University, Japan
  Tomoya Oshikiri, Tohoku University, Japan
 
  Publicity Committee:
  Masayuki Nishi, Kyoto University of Advanced Science, Japan
  Pengyong Hoo, Universiti Malaysia Perlis (UniMAP), Malaysia
  Mohanad Alabdullah, Deakin University, Australia
  Yu-Chih Tzeng, National Central University, Taiwan
......
More info about conference Committees: https://icmda.org/com.html
 
* Submission Method: 
  System Submission: https://confsys.iconf.org/submission/icmda2027
  Email Submission: [email protected]
  For more details, you can learn through: https://icmda.org/sub.html
 
* Call for Paper: 
  Track 1: Materials Design and Computational Engineering
  Track 2: Advanced Functional Materials and Systems
  Track 3: Materials Processing and Manufacturing Technologies
  Track 4: Materials Characterization, Performance and Reliability
  Track 5: Sustainable Materials and Energy Technologies
  Track 6: Materials Applications for Intelligent and Emerging Engineering
  For more information, please visit: http://www.icmda.org/cfp.html
 
* Contact Us:
  Conference Secretary: Ms. Lynn
  Tel:  +852-3155-4897/+86-28-87577778
  Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)
 

Contact

E-mail: [email protected]

Tel: +852-3155-4897

Rank: ★★★★

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